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Touch display meets physical wheel - for convenient & safe interaction

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Cpu-Boards(2)

Compare efusA9 OSM-S Module based on i.MX8ULP
Manufacturer
F&S
F&S
Product type
COM
COM
Formfactor
efus
OSM-S
Architecture
ARM
ARM
CPU
NXP i.MX 6
i.MX 8ULP
Memory (on board)
512MB
2GB LPDDR4 x32
Flash
32 GB eMMC
32 GB eMMC
Operating temp. (low to high)
0 °C to 70 °C
-40 °C to 85 °C
Outline dimensions horizontal
62.10 mm
30.00 mm
Outline dimensions vertical
47.00 mm
30.00 mm
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